Henkel Electronics: Connection Solutions

Henkel´s range of conductive and non-conductive adhesives delivers strong interconnections for reliable, long-lasting performance.

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Henkel´s electronic adhesives are formulated with a variety of chemical bases, offering manufacturers flexibility and tailored solutions for diverse application needs, including low-temperature curing.

Active Alignment Adhesives

Active Alignment Adhesives

Achieve precise optical alignment with advanced dual-cure adhesives designed for reliable performance in LiDAR and ADAS camera modules.

Conductive Inks and Coatings

Conductive Inks and Coatings

Increase design flexibility by printing electronic circuits on thin, lightweight, and flexible substrates- enhancing both functionality and form factor.

Electrically Conductive Adhesives (ECA) SIL-PAD

Electrically Conductive Adhesives (ECA) SIL-PAD

Improve reliability with lead-free solder alternatives, ideal for surface mount technology (SMT), thermal and structural bonding, and EMI applications.

Adhesivos DIE ATTACH

Adhesivos DIE ATTACH

Available in both conductive and non-conductive adhesives with excellent dispensing capabilities and designed to meet the performance demands of high-density chip architectures.

Download our connection solution catalog for automotive electronic components.

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