Henkel Electronics: Connection Solutions

Henkel´s range of conductive and non-conductive adhesives delivers strong interconnections for reliable, long-lasting performance.

Henkel´s electronic adhesives are formulated with a variety of chemical bases, offering manufacturers flexibility and tailored solutions for diverse application needs, including low-temperature curing.

Active Alignment Adhesives

Achieve precise optical alignment with advanced dual-cure adhesives designed for reliable performance in LiDAR and ADAS camera modules.

Conductive Inks and Coatings

Increase design flexibility by printing electronic circuits on thin, lightweight, and flexible substrates- enhancing both functionality and form factor.

Electrically Conductive Adhesives (ECA) SIL-PAD

Improve reliability with lead-free solder alternatives, ideal for surface mount technology (SMT), thermal and structural bonding, and EMI applications.

Adhesivos DIE ATTACH

Available in both conductive and non-conductive adhesives with excellent dispensing capabilities and designed to meet the performance demands of high-density chip architectures.

Download our connection solution catalog for automotive electronic components.

Download Catalog

catálogo de solución de conexión para componentes electrónicos de automóvil

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